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Контент предоставлен Francoise von Trapp. Весь контент подкастов, включая эпизоды, графику и описания подкастов, загружается и предоставляется непосредственно компанией Francoise von Trapp или ее партнером по платформе подкастов. Если вы считаете, что кто-то использует вашу работу, защищенную авторским правом, без вашего разрешения, вы можете выполнить процедуру, описанную здесь https://ru.player.fm/legal.
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So You Want To Be an Interconnectologist? A Conversation with Simon McElrea of LQDX

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Manage episode 440725995 series 2935206
Контент предоставлен Francoise von Trapp. Весь контент подкастов, включая эпизоды, графику и описания подкастов, загружается и предоставляется непосредственно компанией Francoise von Trapp или ее партнером по платформе подкастов. Если вы считаете, что кто-то использует вашу работу, защищенную авторским правом, без вашего разрешения, вы можете выполнить процедуру, описанную здесь https://ru.player.fm/legal.

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In this episode, Francoise speaks with Simon McElrea, an interconnectologist, about his career in and the evolution of interconnectology, emphasizing its importance in semiconductor packaging.

McElrea discusses his roles at semiconductor start-ups like Vertical Circuits and Invensas; his foray into wireless charging at Energous and FreePower; and his return to the semiconductor industry due to its current inflection point.

He talks about how the Chips Act favors large companies over startups and stressed the need for government support to attract young talent and foster innovation. Lastly, McElrea explained how to better support startups and disruptive technologies in the semiconductor industry through policies and funding.

Listen and learn:

· How adopting the term "interconnectology" will change the narrative around advanced packaging

· Why we need to inspire young talent to pursue careers in interconnect-focused fields like packaging through initiatives at universities

· The role of consortia and joint ventures can play

Contact Simon McElrea on LinkedIn

LQDX
LQDX is setting a new metal deposition standard with its breakthrough family of Liquid Metal Inks®.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show

Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

  continue reading

145 эпизодов

Artwork
iconПоделиться
 
Manage episode 440725995 series 2935206
Контент предоставлен Francoise von Trapp. Весь контент подкастов, включая эпизоды, графику и описания подкастов, загружается и предоставляется непосредственно компанией Francoise von Trapp или ее партнером по платформе подкастов. Если вы считаете, что кто-то использует вашу работу, защищенную авторским правом, без вашего разрешения, вы можете выполнить процедуру, описанную здесь https://ru.player.fm/legal.

Send us a text

In this episode, Francoise speaks with Simon McElrea, an interconnectologist, about his career in and the evolution of interconnectology, emphasizing its importance in semiconductor packaging.

McElrea discusses his roles at semiconductor start-ups like Vertical Circuits and Invensas; his foray into wireless charging at Energous and FreePower; and his return to the semiconductor industry due to its current inflection point.

He talks about how the Chips Act favors large companies over startups and stressed the need for government support to attract young talent and foster innovation. Lastly, McElrea explained how to better support startups and disruptive technologies in the semiconductor industry through policies and funding.

Listen and learn:

· How adopting the term "interconnectology" will change the narrative around advanced packaging

· Why we need to inspire young talent to pursue careers in interconnect-focused fields like packaging through initiatives at universities

· The role of consortia and joint ventures can play

Contact Simon McElrea on LinkedIn

LQDX
LQDX is setting a new metal deposition standard with its breakthrough family of Liquid Metal Inks®.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show

Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

  continue reading

145 эпизодов

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